Lepton 2.5, 80x60, 50°, radiometric with shutter

Model: 500-0763-01

Key Specs

Resolution
Sensitivity [NEdT]
Radiometry: 80 x 60; <50 mK (0.050° C); 50°

In Production

$109.00

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NDAA compliant and ITAR free, Lepton® is the highest production volume longwave infrared camera module in the world. Compact and cost-effective, Lepton has enabled thermal innovation adopted by millions of customers. Lepton offers multiple resolutions, four field-of-view (FOV) options, and absolute temperature output on specific models.

Teledyne FLIR continuously enhances the online Lepton integration toolbox to reduce development costs and shorten market time. Application notes, integration videos, quick start guides, and complementary source code for testing on Windows, Linux, Raspberry Pi, and BeagleBone ensure efficient integration. For advanced, large-volume programs, the Technical Services team can support licensing MyFLIR® application software and image enhancing MSX® and Vivid-IR™.

Lepton’s low-power consumption, unmatched image quality, and integration support enable innovative product development in mobile, small electronics, and unattended sensors for smart buildings, fire detection, occupancy tracking, equipment condition monitoring, and more.

ENHANCED THERMAL PERFORMANCE

Greater resolution and sensitivity than common thermopile arrays.

AFFORDABLE MICRO THERMAL CAMERA WITH UNBEATABLE SWAP

Size, power, and lens options enable mobile devices, unattended sensors, and small electronics.

BUILT FOR PROFESSIONAL, LARGE-VOLUME INTEGRATORS

Develop with the industry's leading thermal camera manufacturer to reduce risk, cost, and time to market.

Specifications

Performance

Scene Temperature Range: High Gain Mode: -10 °C to 140 °C (14 °F to 284 °F)
Low Gain Mode: -10 °C to +450 °C (14 °F to 842 °F)

Radiometry

Temperature Accuracy: High gain: Greater of +/- 5°C (41 °F) or 5% (typical) Low gain: Greater of +/- 10°C (50 °F) or 10% (typical)

Temperature Measurement: Yes

Imaging & Optical

FOV - Diagonal: 63.5°

FOV - Horizontal: 50° (nominal)

Frame Rate: 8.6 Hz (commercial application exportable)

Image Optimization: Factory configured and fully automated

Non-Uniformity Correction (NUC): Integrated Shutter

Pixel Pitch: 17 µm

Resolution: 80 × 60, progressive scan

Sensitivity [NEdT]: <50 mK (0.050° C)

Spectral Band: Longwave infrared, 8 µm to 14 µm

Thermal Imager: Uncooled microbolometer

Video Data Interface: Video over SPI

Connections & Communications

Output Format: User-selectable 14-bit, 8-bit (AGC applied), or 24-bit RGB (AGC and colorization applied)

Electrical

Control Port: CCI (I2C-like), CMOS IO Voltage Levels

Input Clock: 25-MHz nominal, CMOS IO Voltage Levels

Input Voltage: 2.8 V, 1.2 V and 2.5 V to 3.1 V IO

Power Consumption: 150 mW (operating), 650 mW (during shutter event), 4 mW (standby)

Mechanical

Mechanical Interface: 32–pin socket interface to standard Molex® socket

Size (L x W x H): 12.7 x 11.8 x 7.2 mm

Weight: 0.9 grams (without socket)

Environmental & Approvals

Compliance and Certifications: NDAA compliant

Non-Operating Temperature Range: -40 °C to +80 °C (14 °F to 176 °F)

Optimum Temperature Range: -10°C to +80°C (-40 °F to 176 °F)

Shock: 1500 G @ 0.4 ms

Solar protection: Integrated

Temperature Compensation: Automatic. Output image independent of camera temperature.