Manufactured and sold by RHP International, the Low Profile Boson USB-C Interface Module is a cutting-edge accessory designed to elevate the performance of the FLIR camera system. This professional-grade VPC Kit features a reversible USB-C connector, ensuring ease of use and compatibility with modern devices. Notably, the module seamlessly supports both USB2 and USB3 speeds, providing versatility for various applications.
The inclusion of Sync IO enables users to synchronize images with other devices, enhancing workflow efficiency. Moreover, this module empowers users to stream multiple 16-bit video streams at a full 60Hz, delivering crystal-clear imagery for detailed analysis.
Designed to enhance usability, it fits perfectly with the Boson Tripod mount, facilitating thermal heatsinking for prolonged usage without compromising performance. Furthermore, its design matches the FLIR USB-C USB 2.0 VPC Kit profile, ensuring seamless integration and backwards compatibility with existing systems, thus making it a vital addition for professionals seeking top-tier thermal imaging capabilities.
The inclusion of Sync IO enables users to synchronize images with other devices, enhancing workflow efficiency. Moreover, this module empowers users to stream multiple 16-bit video streams at a full 60Hz, delivering crystal-clear imagery for detailed analysis.
Designed to enhance usability, it fits perfectly with the Boson Tripod mount, facilitating thermal heatsinking for prolonged usage without compromising performance. Furthermore, its design matches the FLIR USB-C USB 2.0 VPC Kit profile, ensuring seamless integration and backwards compatibility with existing systems, thus making it a vital addition for professionals seeking top-tier thermal imaging capabilities.