The NDAA compliant and ITAR free Hadron™ 640 series pairs a 64 MP visible camera with a performance-leading 640x512 resolution radiometric Boson® or Boson+ thermal camera in a single easy-to-integrate module. With a size, weight, and power (SWaP) optimized design, it is an ideal dual sensor payload for integration into unmanned aircraft systems (UAS), unmanned ground vehicles (UGV), robotic platforms, and emerging AI applications using Teledyne FLIR Prism™ software.
Hadron 640 models share mechanical and electrical interfaces simplifying design. Compatible with Teledyne FLIR’s Prism AI detection, tracking, and classification models and Prism ISP libraries for super-resolution, turbulence mitigation, contrast enhancement, and more, Hadron 640 series enables effective AI-based applications. With drivers available for market leading processors from NVIDIA®, Qualcomm®, and more plus industry-leading integration support, Hadron 640 series minimizes development cost and time to market.
Evaluate Prism with the Hadron 640 series using the Prism Development Kit for Qualcomm RB5 today.
Hadron 640 models share mechanical and electrical interfaces simplifying design. Compatible with Teledyne FLIR’s Prism AI detection, tracking, and classification models and Prism ISP libraries for super-resolution, turbulence mitigation, contrast enhancement, and more, Hadron 640 series enables effective AI-based applications. With drivers available for market leading processors from NVIDIA®, Qualcomm®, and more plus industry-leading integration support, Hadron 640 series minimizes development cost and time to market.
Evaluate Prism with the Hadron 640 series using the Prism Development Kit for Qualcomm RB5 today.
Industry-Leading Thermal and Visible Camera Performance
Collect high-speed, VGA radiometric thermal and HD visible imagery.
Built for Integrators
Reduce development cost and time to market with solution from a single, reliable supplier.
Size, Weight, and Power (SWaP) Optimized Design
Optimize design and operation time with compact, lightweight, and low-power module.
Specifications
Radiometry
- Temperature Measurement
- No
Imaging & Optical
- EO Camera Optics
- Kontatsu B0623D01-0, EFL 4.8mm, 67° HFOV, F/# 1/2.3
- EO Camera Sensor
- 9248 x 6944 pixels (64.2 MP), 0.7 µm pitch, 4-lane MIPI
- EO Camera Video
- Full resolution @ 60 Hz
- FOV - Horizontal
- 32°
- Frame Rate
- Full resolution @ 60 Hz
- IMU
- ICM20602, I2C or SPI (selectable)
- IR Camera Optics
- EFL 13.6mm, 32° HFOV, F/# 1.0
- IR Camera Video
- Full resolution @ 60Hz
- Pixel Pitch
- 12 µm
- Resolution
- 640 x 512
- Sensitivity [NEdT]
- <20 mK
- Thermal Imaging Detector
- Boson+ 640x512 pixels, 12mm pitch, USB 3.0, 2-lane MIPI, Non-Radiometric
Connections & Communications
- Software Drivers
- for NVIDIA Jetson Nano
for Qualcomm Snapdragon rb5
for Qualcomm Snapdrago 865
Electrical
- Electrical Interface
- Hadron connector: Hirose DF40C-50DP-0.4V(51)
Example of mating connector: DF40HC(2.5)-50DS-0.4V(51)
- Power Consumption
- 5V supply voltage. Typical power dissipation < 1800mW, Max < 2900mW
Mechanical
- Mechanical Interface
- Screw mount to back plate
- Size (L x W x H)
- 35 x 49 x 45 mm
- Weight
- 56g
Environmental & Approvals
- Compliance and Certifications
- NDAA compliant
- Environmental Sealing
- IP54 (with the rear interfaces sealed)
- Operational & Storage Temperature
- -20°C to +60°C
- Tested EMI Performance
- FCC part 15 Class B
Resources & Support
Integrating Teledyne FLIR OEM thermal camera modules is easier than ever with our library of how-to videos and more!
Visit the Support Center for help with your Teledyne FLIR OEM products or submit a support ticket, by visiting our Technical Support Center.