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  • FLIR Lepton® Breakout Board v2.0

    The FLIR Lepton® Thermal Camera Breakout Board is an easy-to-interface evaluation board to quickly connect the FLIR Lepton camera module to common platforms like RaspberryPi* or custom hardware. It provides onboard power supplies, generated from 3 – 5.5V, and a master clock. Local power supplies, the master clock, and the power-up sequence components can all be bypassed using a jumper.

    Lepton sold separately.

    *Raspberry Pi is a trademark of the Raspberry Pi Foundation. This product is not designed or qualified for production use.

  • FLIR Lepton® Breakout Board v2.0

    The FLIR Lepton® Thermal Camera Breakout Board is an easy-to-interface evaluation board to quickly connect the FLIR Lepton camera module to common platforms like RaspberryPi* or custom hardware. It provides onboard power supplies, generated from 3 – 5.5V, and a master clock. Local power supplies, the master clock, and the power-up sequence components can all be bypassed using a jumper.

    Lepton sold separately.

    *Raspberry Pi is a trademark of the Raspberry Pi Foundation. This product is not designed or qualified for production use.

  • RHP Boson RC-HD-IF Remote Control Interface

    Manufactured and sold by RHP International, the RHP BOSON RC-HD-IF remote control interface is the perfect solution where HD thermal Video is needed. With 6 to 26 Volts DC input, HD and Composite outputs, and Reverse Polarity Protection, this interface is built for durability.

  • Serdes Box

    The Serdes Box converts an FPD‑Link III or GMSL2 interface to USB, enabling quick and easy integration and early-stage testing with Tura. It delivers video (8‑ or 16‑bit) and I²C control through a single USB connection. For added convenience, the Application Engineering team can provide a Windows®-based GUI that simplifies connecting to Tura and configuring the camera over USB.

  • Hadron 640

    The NDAA compliant and ITAR free Hadron 640 series pairs a 64 MP visible camera with a performance-leading 640x512 resolution radiometric Boson or Boson+ thermal camera in a single easy-to-integrate module. With a size, weight, and power (SWaP) optimized design, it is an ideal dual sensor payload for integration into unmanned aircraft systems (UAS), unmanned ground vehicles (UGV), robotic platforms, and emerging AI applications using Teledyne FLIR Prism software.

  • FLIR ADK

    The FLIR ADK™ is a cost-effective way to develop the next generation of automotive thermal vision for advanced driver assistance systems (ADAS) and autonomous vehicles (AV). Thermal infrared cameras are the best sensor technology for pedestrian detection, reliably classifying people in cluttered environments and giving analytics the critical information needed for automated decision making. The ADK’s rugged, IP67 rated enclosure incorporates a heated window for all-weather driving. With the GMSL and USB interfaces, installation is plug-and-play easy.

  • Lepton

    The FLIR Lepton® is a radiometric-capable LWIR OEM camera solution that is smaller than a dime, fits inside a smartphone, and is one tenth the cost of traditional IR cameras. Using focal plane arrays of either 160x120 or 80x60 active pixels, Lepton easily integrates into native mobile-devices and other electronics as an IR sensor or thermal imager. The radiometric Lepton captures accurate, calibrated, and noncontact temperature data in every pixel of each image.

  • Prism SKR

    Prism SKR provides precision Automatic Target Recognition (ATR) detection, identification, and tracking for autonomously guided weapon systems including loitering munitions, air launched effects (ALE), counter UAS systems (CUAS), low-cost missiles, and smart munitions. It utilizes an advanced algorithm pipeline with target search, target identification, target state estimation, and aim point localization.

  • ISC0002

    The ISC0002 is a 640 × 512 format, 25-micron pitch device, designed for low background applications. A CTIA front end circuit is used and the readout noise in the high gain mode is less than 70 electrons. Compatible with P-on-N detectors such as InGaAs, SLS and MCT, this large format ROIC supports the same advanced features as the other standard ROICs, snapshot mode, adjustable integration time and gain, skimming, power and current adjustments, and additionally supports selectable integration capacitors (39K or 1.9M electrons).

  • DDCA FLIR

    InSb-based detector dewar cooler assemblies (DDCAs) are available – in linear cryogenic cooler configurations – to qualified customers who accept the risks and support that are inherent with integrating a subassembly. The standard linear design uses a 1/3 Watt cooler. DDCAs are designed to operate in harsh environmental conditions and over a wide operating temperature range.

  • ISC0701

    Readout integrated circuit (ROIC) X-ray 128 × 1 channel, 80-micron pitch device.

  • ISC1308

    The ISC 1308 is a dual polarity, dual band 1280 × 1024 format, 12-micron pitch ROIC. This ROIC can be operated as a dual or single-color device. The ROIC has been specifically designed to allow for both polarities of detectors to be placed back-to-back and to connect to the ROIC through the one input pad to obtain a two-color image. The ISC1308 supports multiple output mode, windowing, adjustable integration time and mode, two integration capacitors and adjustable bias settings.