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  • FLIR Lepton® Breakout Board v2.0

    The FLIR Lepton® Thermal Camera Breakout Board is an easy-to-interface evaluation board to quickly connect the FLIR Lepton camera module to common platforms like RaspberryPi* or custom hardware. It provides onboard power supplies, generated from 3 – 5.5V, and a master clock. Local power supplies, the master clock, and the power-up sequence components can all be bypassed using a jumper.

    Lepton sold separately.

    *Raspberry Pi is a trademark of the Raspberry Pi Foundation. This product is not designed or qualified for production use.

  • FLIR Lepton® Breakout Board v2.0

    The FLIR Lepton® Thermal Camera Breakout Board is an easy-to-interface evaluation board to quickly connect the FLIR Lepton camera module to common platforms like RaspberryPi* or custom hardware. It provides onboard power supplies, generated from 3 – 5.5V, and a master clock. Local power supplies, the master clock, and the power-up sequence components can all be bypassed using a jumper.

    Lepton sold separately.

    *Raspberry Pi is a trademark of the Raspberry Pi Foundation. This product is not designed or qualified for production use.

  • RHP Boson RC-HD-IF Remote Control Interface

    Manufactured and sold by RHP International, the RHP BOSON RC-HD-IF remote control interface is the perfect solution where HD thermal Video is needed. With 6 to 26 Volts DC input, HD and Composite outputs, and Reverse Polarity Protection, this interface is built for durability.

  • Serdes Box

    The Serdes Box converts an FPD‑Link III or GMSL2 interface to USB, enabling quick and easy integration and early-stage testing with Tura. It delivers video (8‑ or 16‑bit) and I²C control through a single USB connection. For added convenience, the Application Engineering team can provide a Windows®-based GUI that simplifies connecting to Tura and configuring the camera over USB.

  • FLIR ADK

    The FLIR ADK™ is a cost-effective way to develop the next generation of automotive thermal vision for advanced driver assistance systems (ADAS) and autonomous vehicles (AV). Thermal infrared cameras are the best sensor technology for pedestrian detection, reliably classifying people in cluttered environments and giving analytics the critical information needed for automated decision making. The ADK’s rugged, IP67 rated enclosure incorporates a heated window for all-weather driving. With the GMSL and USB interfaces, installation is plug-and-play easy.

  • ISC0002

    The ISC0002 is a 640 × 512 format, 25-micron pitch device, designed for low background applications. A CTIA front end circuit is used and the readout noise in the high gain mode is less than 70 electrons. Compatible with P-on-N detectors such as InGaAs, SLS and MCT, this large format ROIC supports the same advanced features as the other standard ROICs, snapshot mode, adjustable integration time and gain, skimming, power and current adjustments, and additionally supports selectable integration capacitors (39K or 1.9M electrons).

  • DDCA FLIR

    InSb-based detector dewar cooler assemblies (DDCAs) are available – in linear cryogenic cooler configurations – to qualified customers who accept the risks and support that are inherent with integrating a subassembly. The standard linear design uses a 1/3 Watt cooler. DDCAs are designed to operate in harsh environmental conditions and over a wide operating temperature range.

  • ISC0701

    Readout integrated circuit (ROIC) X-ray 128 × 1 channel, 80-micron pitch device.

  • ISC1308

    The ISC 1308 is a dual polarity, dual band 1280 × 1024 format, 12-micron pitch ROIC. This ROIC can be operated as a dual or single-color device. The ROIC has been specifically designed to allow for both polarities of detectors to be placed back-to-back and to connect to the ROIC through the one input pad to obtain a two-color image. The ISC1308 supports multiple output mode, windowing, adjustable integration time and mode, two integration capacitors and adjustable bias settings.

  • ISC1404

    The ISC1404 is large, well optimized for InSb and SLS, 2K × 2K format, 10 micron pitch ROIC.

  • ISC0208

    The ISC0208 is a high-performance, European format, 384 × 288 pixel readout integrated circuit. Two versions are available, -1 with a 18Me well capacity designed for use with QWIP detectors and -2 with a 13Me well capacity for InSb detectors. The ISC0208 is built using a submicron complementary metal-oxide-silicon process, built in 8-inch wafer form. Devices are typically delivered in 6-inch wafer form with extensive user documentation and test data included with each delivery.

  • SWIR (InGaAs) FPA

    FLIR SWIR InGaAs FPAs cover the 0.9 to 1.7 µm spectral range. FPAs are hybrid assemblies that are mounted on 84-pin leadless chip carriers or integrated into packaged sensor assemblies. These arrays utilize a capacitive transimpedance amplifier circuit design, optimized for a wide range of applications, including those with low signal levels, terrestrial applications that use a single channel video rate output, as well as high-speed scientific laser testing where multiple outputs and dynamic windowing are needed.