Prism ISP includes Teledyne FLIR’s patented MSX® technology, which overlays visible‑edge detail onto thermal imagery for enhanced real‑time clarity. Thermographic tools include regions of interest (ROI), spot meters, isotherms, adjustable color palettes, and additional measurement overlays. VividIR™, Teledyne FLIR OEM’s patented image‑processing technique, delivers superior thermal sharpness and detail typically associated with more expensive QVGA sensors.
For the first time, Lepton XDS also supports saving images in advanced radiometric JPEG (RJPG) format, ensuring seamless compatibility with the broader software ecosystem, including FLIR Thermal Studio for post‑processing and report generation.
STREAMLINE OEM INTEGRATION
Optimize design and schedule with intelligent and compact dual-camera module
- Factory-aligned radiometric 160x120 thermal and 5MP visible camera
- Accelerate integration with Development Board Kit accessory
- Compact size and lightweight 5.6g with USB output
SUPERIOR IMAGERY FEATURING PRISM ISP
Real-time, advanced image signal processing optimizes multi-spectral image
- Patented FLIR MSX and VividIR included
- Advanced measurement and symbology provide ROIs, spot meters, and color palettes
- Access to radiometric JPEG file formats for seamless use in the FLIR ecosystem
HIGH-VOLUME PRODUCTION
Develop with the industry-leading thermal camera manufacturer to reduce risk, cost, and time to market
- ITAR free and classified under US Department of Commerce jurisdiction as ECCN 6a993.b.4.b
- Highly qualified, technical services team available to support integration
- Proven consumer electronics quality assurance metrics
Specifications
Radiometry
- Temperature Accuracy
- High Gain: Greater of ±5 °C (41 °F) or 5% (typical)
Low Gain: Greater of ±10 °C (50 °F) or 10% (typical)
Imaging & Optical
- EO Camera Optics
- EFL 1.57 mm, 98.2° HFOV, F/1/2.2
- EO Camera Sensor
- 2592 x 1944 pixels (5 MP), 1.4 µm pitch
- EO Camera Video
- 640x480 @ 30Hz
- IMU
- No IMU installed
- IR Camera Optics
- 57° HFOV, f/1.1
- IR Camera Video
- 8.7 Hz (commercial application exportable)
- Thermal Imaging Detector
- Lepton 3.5 160 x 120 pixels, 12 µm pitch
- Thermal Sensitivity
- <50 mK (0.050 °C)
Electrical
- Power
- 1.6 W Operating, 1.9 W Shutter Event, and 500 mW Standby
Mechanical
- Size
- 29 x 26.7 x 8.8 mm (1.14 × 1.05 × 0.35 in.)
- Weight
- 5.6 g (0.20 oz)
Environmental & Approvals
- Environmental Sealing
- N/A
- Non-Operating Temperature Range
- -40 °C to +70 °C (-40 °F to 158 °F)
- Operating Temperature Range
- 0 °C to +60 °C (32 °F to 140 °F)
- Tested EMI Performance
- FCC: 47 CFR FCC Part 15, Subpart B, Class B
Export Designations
- ECCN Code
- 6a993.b.4.b
Resources & Support
Assets below are shared by all models in this product family.
The Engineering Datasheet provides detailed information.
- Functional Characteristics
- Technical Specifications
- Performance Data
- Electrical and External Circuitry
- Mechanical Recommendations
The mechanical drawings and 3D files are available in IDD+ and STEP formats.
Lepton Series Datasheet
Lepton XDS Datasheet
Lepton XDS Engineering Datasheet r100
IDD LEPTON XDS Assembly, 160x120, 5MP
Lepton Software IDD Rev 303
Lepton XDS Assembly Drawing Rev-A
Integrating Teledyne FLIR OEM thermal camera modules is easier than ever with our library of how-to videos and more!
Visit the Support Center for help with your Teledyne FLIR OEM products or submit a support ticket, by visiting our Technical Support Center.
Related Products
Boson+
High Performance, Uncooled, LWIR OEM Thermal Camera Module
- 320 × 256 or 640 × 512 Resolution
- ≤20 mK Thermal Sensitivity [NEdT]
- 4° to 95° HFoV
Lepton
LWIR Micro Thermal Camera Module
- 80 x 60 or 160 x 120 Resolution
- Radiometry Optional
- 50° to 160° HFoV
Lepton XDS Development Board Kit
Plug and Play Expansion Board
- USB Interface
- Lepton XDS not included
Prism AI
Object Detection and Tracking Software Libraries
- 40+ Detection Categories
- 4M Training Annotations
- Compatible with Qualcomm or NVIDIA
