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Prism Development Kit Qualcomm RB5

Model: 421-0100-00
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In Production
The Prism™ Development Kit for Qualcomm® RB5 enables system engineers to evaluate Prism ISP and Prism AI with the output of Teledyne FLIR’s Hadron™ thermal imaging camera modules. Prism ISP software includes image fusion, super resolution, turbulence mitigation, electronic imaging stabilization, 16-to-8-bit tone mapping, and local contrast enhancement (LCE). Prism AI features a mature perception software that includes object classification, object detection, object tracking, and fine-grained classification trained on the world’s largest thermal image data lake with over 5 million annotation assets.

The development kit includes Teledyne FLIR’s Hadron dual visible and thermal camera module, all necessary cables, and the Qualcomm Robotics RB5 QRB5165 system on chip (SoC), the most popular and efficient mobile processor for digital imaging, bringing unprecedented capabilities to Teledyne FLIR thermal camera module integrators.
 


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EVALUATE THERMAL AND EDGE AI

Get started with thermal infrared object detectors and advanced image signal processing.

  • Air-to-ground, automotive autonomy, counter UAS, and security/ISR models
  • Preinstalled libraries simplify perception and computational imaging evaluation
  • AI DSP co-processor with 3 TOPS and 8 TOPS on the Hexagon™ Tensor Accelerator (HTA) for running models at 8INT
  • Web interface
 

DEVELOP ON THE QUALCOMM ROBOTICS RB5 PLATFORM

Utilize the flexible and most popular mobile SoC.

  • 15 TOPS compute power
  • 8 CPU cores
  • USB and MIPI camera interfaces
  • 16 GB LPDDR5 up to 2750 MHz and LPDDR4X up to 2133 MHz
  • 1 x 1GbE Ethernet


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DESIGNED FOR INTEGRATORS

Simplify development and reduce risk with Prism software and support.

  • SDK for Linux 20.04 OS
  • Development support by qualified engineers
  • Sample applications included
  • Ongoing AI model development using the industry’s largest thermal data lake

Specifications

General

Memory
16 GB LPDDR5 up to 2750 MHz and LPDDR4X up to 2133 MHz
Part Number
421-0100-00
Processor
AI DSP co-processor with 3 TOPS and 8 TOPS on the Hexagon™ Tensor Accelerator (HTA) for running models at 8INT
15 TOPS total compute power
8 CPU cores

Hardware

Operating System (OS)
Linux LU20.04 OS

Software Features

AI Models
Air to Ground, Counter UAS, Ground ISR, Security, Automotive Autonomy
ISP Libraries
Turbulence Mitigation, Super Resolution, Electronic Stabilization, 16-8 bit Tone Mapping, Denoise

Thermal Camera

Pixel Pitch
12 µm

Media gallery

Deploying AI Object Detection, Target Tracking, and Computational Imaging on Embedded Processors
Maximize Perception with Prism ISP and AI Tools for Enhanced Thermal Imaging | SPIE DCS 2024

Resources & Support

News articles and white papers written by Teledyne FLIR OEM experts to help you integrate your Teledyne FLIR OEM products.

For technical questions, find answers by visiting our FAQ at: flir.custhelp.com

Whitepaper

AI Detection, Target Tracking, and Computational Imaging on Embedded Processors

Learn more

Assets below are shared by all models in this product family.

Prism Development Kit Qualcomm RB5 Datasheet

Datasheet

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