Hadron 640 models share mechanical and electrical interfaces simplifying design. Compatible with Teledyne FLIR’s Prism AI detection, tracking, and classification models and Prism ISP libraries for super-resolution, turbulence mitigation, contrast enhancement, and more, Hadron 640 series enables effective AI-based applications. With drivers available for market leading processors from NVIDIA®, Qualcomm®, and more plus industry-leading integration support, Hadron 640 series minimizes development cost and time to market.
Evaluate Prism with the Hadron 640 series using the Prism Development Kit for Qualcomm RB5 today.
Industry-Leading Thermal and Visible Camera Performance
Collect high-speed, VGA radiometric thermal and HD visible imagery.
Built for Integrators
Reduce development cost and time to market with solution from a single, reliable supplier.
Size, Weight, and Power (SWaP) Optimized Design
Optimize design and operation time with compact, lightweight, and low-power module.
Specifications
Radiometry
- Temperature Accuracy
- ±5 °C less, over 0 °C to 100 °C range
- Temperature Measurement
- Yes
Imaging & Optical
- EO Camera Optics
- Kontatsu B0623D01-0, EFL 4.8mm, 67° HFOV, F/# 1/2.3
- EO Camera Sensor
- 9248 x 6944 pixels (64.2 MP), 0.7 µm pitch, 4-lane MIPI
- EO Camera Video
- Full resolution @ 60 Hz
- FOV - Horizontal
- 32°
- Frame Rate
- Full resolution @ 60 Hz
- IMU
- ICM20602, I2C or SPI (selectable)
- IR Camera Optics
- EFL 13.6mm, 32° HFOV, F/# 1.0
- IR Camera Video
- Full resolution @ 60 Hz
- Pixel Pitch
- 12 µm
- Resolution
- 640 x 512
- Sensitivity [NEdT]
- <20 mK
- Thermal Imaging Detector
- Boson+ 640x512 pixels, 12mm pitch, USB 3.0, 2-lane MIPI, Radiometric
Connections & Communications
- Software Drivers
- for NVIDIA Jetson Nano
for Qualcomm Snapdragon RB5
for Qualcomm Snapdrago 865
Electrical
- Electrical Interface
- Hadron connector: Hirose DF40C-50DP-0.4V(51)
Example of mating connector: DF40HC(2.5)-50DS-0.4V(51)
- Power Consumption
- 5V supply voltage. Typical power dissipation < 1800mW, Max < 2900mW
Mechanical
- Mechanical Interface
- Screw mount to back plate
- Size (L x W x H)
- 35 x 49 x 45 mm
- Weight
- 56g
Environmental & Approvals
- Compliance and Certifications
- NDAA compliant
- Environmental Sealing
- IP54 (with the rear interfaces sealed)
- Operational & Storage Temperature
- -20°C to +60°C
- Tested EMI Performance
- FCC part 15 Class B
Media gallery
Resources & Support
News articles and white papers written by Teledyne FLIR OEM experts to help you integrate your Teledyne FLIR OEM products.
For technical questions, find answers by visiting our FAQ at: flir.custhelp.com
FAQ
Can a FLIR OEM camera data be streamed to disk over the PCI-1422 card and displayed real time?
Read the StoryAssets below are shared by all models in this product family.
The Engineering Datasheet provides detailed information.
- Functional Characteristics
- Technical Specifications
- Performance Data
- Electrical and External Circuitry
- Mechanical Recommendations
The mechanical drawings and 3D files are available in IDD+ and STEP formats.
Hadron 640 Family Engineering Datasheet R170
Hadron 640 Series Datasheet
Hadron 640R Integration Guide Rev 1.12
Visit the Support Center for help with your Teledyne FLIR OEM products or submit a support ticket, by visiting our Technical Support Center.
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Hadron 640 Development Kits
Development Kits for Hadron 640 Dual Camera Module
- Dual Thermal and Visible Camera
- Compatible with Qualcomm® or NVIDIA®
- AI-Ready
Prism AI
Object Detection and Tracking Software Libraries
- 40+ Detection Categories
- 4M Training Annotations
- Compatible with Qualcomm or NVIDIA
Prism Development Kit for Qualcomm RB5
Prism Software and LWIR Camera Evaluation Kit
- Compatible with Prism AI and Prism ISP
- SDK for Linux 20.04 OS
- Hadron Dual Visible and Thermal Camera
Prism ISP
Advanced Computational Image Processing Software
- Super Resolution, MSX, VividIR, and more
- Supports LWIR, MWIR, and Visible
- Compatible with Qualcomm or NVIDIA