Compact and configurable VGA
InGaAs 640 × 512/15µm pixel pitch FPA, <21 × 21 × 28 mm and 15.5 grams lensless, low power consumption with <1.6W @ 21°C, rugged construction and wide operational temperature rating -20°C to +60°C
Simplify & shorten time to market
Built-in support for physical and protocol level industry standards including USB2, full suite of hardware accessories, FLIR XIR expandable infrared video processing architecture and a robust SDK, classified under US Department of Commerce jurisdiction as EAR 6A003.b.4.a
FLIR performance, reliability & support
Industry’s most advanced SWaP+C-optimized image processing, commercially developed, military qualified (CDMQ), uncooled FPA temperature compensation (TEC-less), highly qualified FLIR Technical Services team to support integration
Specifications
Performance
- Time to Image
- <2 sec
Imaging & Optical
- Active Area
- 9.6 × 7.68 mm
- Array format
- 640 × 512
- Detector Type
- Indium Gallium Arsenide (InGaAs)
- Frame Rate
- 60Hz
- Lens Mount
- M18 mount, C-mount adapter available
- Operability
- >99.5% (Industrial Spec); >99.0% (Professional Spec); >98.0% (Consumer Spec)
- Optical Fill Factor
- 100%
- Pixel Size
- 15 µm
- Quantum Efficiency
- > 65% (Industrial Spec)
- Sensor Technology
- Shortwave Infrared (SWIR) Camera Core
- Spectral Range
- 0.9 – 1.7 µm (SWIR); 0.6 – 1.7 µm (Vis-SWIR)
Connections & Communications
- Control Channels
- UART or USB
- Video Channels
- CMOS or USB2
Electrical
- Input Supply Voltage
- 3.3 VDC
Mechanical
- ESD Protection
- Built-In
- Precision Mounting Holes
- M1.6 × 0.35 on 2 sides, 2 per side
- Size (L x W x H)
- <21 × 21 × 28 mm
- Weight
- 15.5 grams lensless
Environmental & Approvals
- Operating Temperature Range
- -20°C to +60°C with correct heatsink
- Shock
- 1500g @ 0.4 msec
Resources & Support

Boson SWIR Datasheet