Hadron 640 Development Kits
The Hadron™ 640 development kits accelerate integration of the Hadron 640 series with leading platforms, featuring reference hardware and software from Qualcomm® RB5 or NVIDIA® Jetson Nano. These kits enable rapid imaging and control of both thermal and visible cameras, while simplifying driver integration and AI development for your end application.
The NDAA-compliant, ITAR-free Hadron 640 series combines a 64 MP visible camera with a high-performance 640 × 512 radiometric Boson® or Boson+ thermal camera in a single, IP54-rated module. With a size, weight, and power (SWaP) optimized design and ready-to-use development kits, Hadron 640 series is the ideal dual-sensor payload for unmanned aircraft systems (UAS), unmanned ground vehicles (UGV), robotics, and AI-driven platforms—where battery life and mission-critical runtime matter most.
PLUG-AND-PLAY DEVELOPMENT SOLUTION
Same-day operation reduces development cost and time to market
- Includes interface boards and cabling hardware (development board not included)
- Drivers available for NVIDIA Jetson Nano and Qualcomm RB5Supports Linux and Android development
- US-based technical services team available to support integration
INDUSTRY-LEADING THERMAL AND VISIBLE CAMERA PERFORMANCE
Collect high-speed, dual VGA radiometric thermal and HD visible imagery
- 64MP visible camera resolution
- Compact, radiometric, 640x512-resolution Boson or Boson+ provides the temperature of every pixel
- Flexible dual 60 Hz video output via USB or MIPI
- Classified under US Department of Commerce jurisdiction as EAR99
SIZE, WEIGHT, AND POWER OPTIMIZED DESIGN
Extend operation time with compact, lightweight, and low-power module
- Low, steady state power consumption at 1.8W
- IP54-rated dust and water protection
- Lightweight 56 g enables longer flight time and extends battery life
Model Finder
| Status | ||
|---|---|---|
NVIDIA Jetson Nano Test Kit for Hadron 640R421-0095-00 |
In Production Request Info |
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Qualcomm RB5 Test Kit for Hadron 640R421-0096-00 |
In Production Request Info |
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Qualcomm Snapdragon 865 Open Q Test Kit for Hadron 640R421-0094-00 |
In Production Request Info |
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Resources & Support
Assets below are shared by all models in this product family.
The Engineering Datasheet provides detailed information.
- Functional Characteristics
- Technical Specifications
- Performance Data
- Electrical and External Circuitry
- Mechanical Recommendations
The mechanical drawings and 3D files are available in IDD+ and STEP formats.
Visit the Support Center for help with your Teledyne FLIR OEM products or submit a support ticket, by visiting our Technical Support Center.
Boson+
High Performance, Uncooled, LWIR OEM Thermal Camera Module
- 320 × 256 or 640 × 512 Resolution
- ≤20 mK Thermal Sensitivity [NEdT]
- 4° to 95° HFoV
Hadron 640
High Performance, Dual Thermal and Visible OEM Camera Module
- 640 x 512 Thermal Resolution
- 64 MP Visible Camera
- Radiometry Available
FLIR AVP
SWaP-Optimized SOM for Prism
- Qualcomm Dragonwing QCS8550
- 48 TOPS INT 8 AI Processor
- 2.5 W Typical
Prism AI
Object Detection and Tracking Software Libraries
- 40+ Detection Categories
- 4M Training Annotations
- Compatible with Qualcomm or NVIDIA
Prism ISP
Advanced Computational Image Processing Software
- Super Resolution, MSX, VividIR, and more
- Supports LWIR, MWIR, and Visible
- Compatible with Qualcomm or NVIDIA